受新加坡某半导体封装后道公司委托，招聘半导体封装后道Flip Chip & Mold Process Assistant Engineer
工作地点：新加坡
Responsibilities
Perform equipment setup and buyoff. Troubleshooting whenever necessary.
Monitor process output parameter to ensure fulfillment of requirements and specifications provided.
Support engineering build related to new packaging / process for customer sampling or internal evaluations.
Run evaluations per plan and collect and compile necessary data for analysis.
Requirements
1- 3 years working experience in Flip Chip Processes such as FC Attach, Underfill or Post Mold Processes such as Ball Mount, Laser Marking, VM etc
Adv.Diploma in Engineering or equivalent.
Good problem solving and computer skills
Willingness to work shift and support 24/7.
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