受新加坡某半导体封装后道公司委托，招聘半导体封装后道Technology Proliferation and Pathfinding Resources Engineer
工作地点：新加坡
Responsibilities
Technical assessment on new material that has no baseline evaluated before, or no-known capability in Assembly
Co-work with process / design / simulation groups to address issues based on materials technicality.
Define new materials critical buy-off criteria & special properties procurement specifications
Improve material selection & qualification efficiency by partnering with suppliers via collaborations
Perform risk management approach for new DM implementation (i.e. product readiness, cost, MOQ, HVM stability)
Improved time to market with stable and readily available suitable material
Requirements
Min working experience in semiconductor or related field for 3-5 years.
Bachelors degree in Materials related Course (Chemical Engg, Materials Science, Metallurgy Engg)
Exposure at EOL process and with good baseline understanding on mold materials.
Good demonstration in interpersonal relationship.
Able to work under a fast pace working environment.
