Responsibilities

To be involved in the next generation advanced packaging and technology development for Company specifically in the area of Advanced Flip Chip Packages.

Develop/Enhance current/new assembly process and materials focusing on single/multi-stacked Hybrid flip chip die bonding & Underfill processes. Advanced 40/32/28nm Flip chip ELK technology development.

Work closely with equipment vendors and local research institute for new and advanced assembly processes.

Provide expert opinions and problem resolutions on assembly issues

Promote Company excellence via external technical presentations and publications.

 

Requirements

PhD/ Masters/ Bachelor in Engineering with minimum 3-5 year’s experience in IC packaging, specifically in Flip-Chip Assembly.

Min 2-3 years of Process Development experience in 1 or more of the following processes: Flip Chip Attach/Reflow, Unerfill Dispense, HS/SR Attach or Flux Cleaning is required

Prior research experiences in 40/32/28nm ELK Technology, NCP, No-flow UF, pre-applied or wafer-level UF will be an added advantage.

Innovative, creative and resourceful.

A team player, but at the same time independent and proactive.

Good communication & interpersonal skills. Able to work well with peers and management.