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赴新加坡半导体封装后道Wafer Prep Engineer



受新加坡某半导体封装后道公司委托,招聘赴新加坡半导体封装后道Wafer Prep Engineer
工作地点:新加坡
 
Responsibilities
Support engineering build related to new packaging / process for customer sampling or internal evaluations.
Provide support in documentation for process control during technology offload to assembly.
Run evaluations per plan and collect necessary data for analysis.
Liaise with suppliers to identify improvements required on equipment or materials.
 
Requirements
At least 3 years' experience in IC assembly companies, in Front-Of-Line (FOL).
Bachelor in Engineering or equivalent.
Good problem solving, communication and presentation skills
Knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE)
 


有兴趣者请将中英文简历发到以下邮箱:wanco@wanco.com.cn or resume@wanco.com.cn









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