1.Able to complete service requests with results (images, measurements) for more than one of the below:
a. Structural cross-section imaging and measure:
•SEM, FIB, Wafer Constructional Analysis, SEM Inspection, Chemical Delineation
b. Elemental check using EDX
c. Bulk Silicon Resistivity measure using Spread Resistance Profiling (SRP)
......
2. Able to complete the analysis request with a report for more than one of the below:
a. Topology – AFM(SPM)/Optical Profiler
b. Bulk Silicon Resistivity measurement using SRP
c. Particle/Bond-pad/Junction/Powder Analysis
d. Passivation Integrity Test
......
3. Able to execute Wafer/Sample Disposal after job completion
4. Able to perform TPM / Verification task by strictly following checklist
a. SEMb. SRP c. AFM d. Oven
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