公司:半导体芯片设计公司(外资)
工作地点:北京海淀区
Essential Responsibilities:
• The backend design engineer will be participating in the development of Design for Test
• Physical implementation and optimization
• Package and electrical design
• Electronic Design Automation (EDA) & methodology development and deployment
• Chip hardware validation
任职要求:
• CS/EE or background in areas related to digital or analog chip design
• 10+ years experience in Chip Design can be considered
• Research and development experience in one or more of the following areas:
• ASIC back-end design methodology: Knowledge of floor planning, physical design, timing, DFT, signal/power integrity, packaging, synthesis, and other back-end activities
• EDA algorithm, tool, and methodology development.
• Experience/knowledge in analog and mixed-signal IP design, test and evaluation with Bulk CMOS, BiCMOS, SiGe, or SOI technologies
• Proficiency in Verilog/VHDL, and familiarity with programming and scripting languages
• Experience in one or some of the application domains, will be a plus
• High performance computing (servers) system, processor, chipset and ASICs
• Communication, networking and wireless applications
• DSP, RISC Processor architecture, Digital media, audio/video graphic and gaming processing
• Consumer electronics applications
• High Speed Interface/Serdes applications
• Good software background and strong C/C++ skill
• Other emerging technology and industry areas
• Good English skills, communication skills, and willingness to work with a global team. Skill in other languages will be a plus.
• Good learning competency and ability to work in diverse areas in a flexible environment
简历投递:semi@wanco.com.cn,请写上应聘的职位。
企业QQ可详细咨询:800066950 (找服务);
上海万谷境外就业服务有限公司
Shanghai Wanco Overseas Employment ServiceCo., Ltd
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