Responsibility:
 

·To understand Wafer Sort, Final Test Flow and Failure Mode through communication with customer and provide directions to Process Integration/Yield Engineering team for actions required

·To conduct testing and manual test and provide guidance to Failure Analysis Team

·To contribute to New Product Qualification and Yield Improvement

·Understand new product design and test to provide product yield analysis in identifying root cause of wafer sort and final test failures

·Support fab in yield improvement activities by developing bitmap capability for new devices and coordinate test program development activities and changes between customers, vendors and test house

·Liaise with customer, Field Engineer/Customer Engineer to maximize die output

·Support cost reduction through yield improvement and diagnose product failure modes and correlate them to sort summary

·Establish device low yield criteria and lots disposition

·Use Yield Management System to identify ET and inline parameters that correlate to sort yield

·Support failure analysis lab for electrical fault isolation and reliability lab to understand and resolve reliability failures

·Provide technical expertise to Customer Engineers and test house to help customers run their product-level evaluations

·Resolve yield, quality and reliability issues in the qualification of new devices

 

Requirements:
·Bachelor Degree in Electrical/Electronics Engineering or Science in Chemistry/Physics/Material Sciences with min 2 years of working experience

·Experience in IC process module and yield engineering is preferred.

·Experience in circuit design and process/circuit simulation will be an added advantage

·Good interpersonal and communication skills